Wafer Billet

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Al-Si Alloy Electronic Packaging

Wafer Billet

Material:Si-30%Al alloy/Si-20%Al alloy

Baienwei AlSi70/AlSi80 alloys in different sizes are available in the form of bars.Si-30%Al alloy or Si-20%Al alloy

is being widely used for wafer level packages as substrate/contact.

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  • Product Details

Typical application

  • Wafer substrate for high-brightness LED


Selectable silicon/aluminum(Si/Al) alloy

  • AlSi70(Si-30%Al controlled expansion alloy);

  • AlSi80(Si-20%Al controlled expansion alloy).


Other applications of AlSi70 or AlSi80 alloy

  • Microwave carrier for telecommunication;
  • Cold plate material for high-energy solid state laser;

  • Photovoltaic(PV) cells.


Alternative material

  • Al2O₃;
  • Copper-molybdenum(Cu-Mo).


Main benefits

  • CTE close to that of arsenic gallium(GaAs) and Sapphire;

  • High thermal conductivity;

  • Thermal stability;
  • Readily machining and eletroless plating(e.g.Ni/Au);
  • Wafer diameter can be achieved by 300mm and polishing to 10nm Ra.


AlSi Alloys Performance Parameters

Content

wt%

  Density  

g/cm³

CTE 

25℃

 ppm/℃

Thermal 

Conductivity

25℃ W/mK

Tensile 

Strength 

MPa

Yield 

Strength 

MPa

Poisson’s 

Ratio

Elongation

%

Elastic

Modulus

 GPa

Al-27%Si

2.6

17

175

170

130

0.29

3.8

91

Al-42%Si

2.55

13.5

143

200

187

0.29

1

105

Al-50%Si

2.5

11.5

140

200

210

0.28

<1

108

Si-40%Al

2.46

9

125

181

181

0.27

<1

121

Si-30%Al

2.43

7.5

120

138

138

0.25

<1

131

Si-20%Al

2.40

6

110

125

125

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